Title:
COPPER ALLOY SHEET MATERIAL AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2023/157614
Kind Code:
A1
Abstract:
Provided are: a copper alloy sheet material with high tensile strength and a small temperature coefficient of resistance (TCR), thereby making it possible to increase the reliability of products to which said sheet material is applied, such as connectors and lead frames; and a method for manufacturing the copper alloy sheet material. The copper alloy sheet material has an alloy composition in which at least one component among Ni and Co is in a total of 0.50 mass% or more and 5.00 mass% or less, Si is contained in a range of 0.10 mass% or more and 1.50 mass% or less, and the remainder is Cu and unavoidable impurities. The area ratio of crystal grains for a measured GROD value range of 0° or more and 5° or less when the GROD value was measured using EBSD in a cross-section including the rolling direction and the thickness direction of the copper alloy sheet material is in the range of 20% or more and 82% or less. The tensile strength is 500 MPa or more and the temperature coefficient of resistance (TCR) in a temperature range of from 20°C to 150°C is 3000 ppm/°C or less.
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Inventors:
AKIYA SHUNTA (JP)
AMEMIYA YUUTAROU (JP)
KAWATA SHINGO (JP)
TAKAZAWA TSUKASA (JP)
AMEMIYA YUUTAROU (JP)
KAWATA SHINGO (JP)
TAKAZAWA TSUKASA (JP)
Application Number:
PCT/JP2023/002736
Publication Date:
August 24, 2023
Filing Date:
January 27, 2023
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C22C9/00; C22C9/02; C22C9/04; C22C9/06; C22C9/10; C22F1/08; H01B1/02; H01B5/00; H01B13/00; C22F1/00
Domestic Patent References:
| WO2020196791A1 | 2020-10-01 |
Foreign References:
| JP2018162510A | 2018-10-18 | |||
| JP2010100890A | 2010-05-06 | |||
| JP2019157153A | 2019-09-19 |
Attorney, Agent or Firm:
KURUMA Kiyoshi et al. (JP)
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