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Title:
COPPER ALLOY SHEET
Document Type and Number:
WIPO Patent Application WO/2011/068124
Kind Code:
A1
Abstract:
Provided is a Corson copper alloy sheet which satisfies property requirements for terminals or connectors, such as strength and bendability. The copper alloy sheet is a copper alloy sheet for electric/electronic components which has a copper alloy composition containing, in terms of mass%, 0.8-5% Ni and/or Co and 0.2-1.5% Si, with the remainder comprising Cu and incidental impurities, wherein the areal proportion of crystal grains deflected at an angle less than 15º from the cube orientation has been regulated so as to be less than 10% and the areal proportion of crystal grains deflected at an angle of 15-30º from the cube orientation has been regulated to 15% or higher. The copper alloy sheet has excellent strength and bendability.

Inventors:
SATO KOJI (JP)
KANEKO HIROSHI (JP)
Application Number:
PCT/JP2010/071494
Publication Date:
June 09, 2011
Filing Date:
December 01, 2010
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
SATO KOJI (JP)
KANEKO HIROSHI (JP)
International Classes:
C22C9/06; C22C9/00; C22C9/02; C22C9/04; C22C9/05; C22C9/10; C22F1/08; H01B1/02; H01B5/02; C22F1/00
Domestic Patent References:
WO2008105453A12008-09-04
WO2009044822A12009-04-09
WO2007148712A12007-12-27
Foreign References:
JP2006152392A2006-06-15
JP2006283059A2006-10-19
JP2009242932A2009-10-22
JP2008088512A2008-04-17
JPH06184680A1994-07-05
JP2006161148A2006-06-22
JP2006152392A2006-06-15
JP2009007666A2009-01-15
JP2008223136A2008-09-25
Other References:
See also references of EP 2508632A4
Attorney, Agent or Firm:
IIDA, Toshizo et al. (JP)
Toshizo Iida (JP)
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