Title:
COPPER-ALLOY SLIDING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2021/075447
Kind Code:
A1
Abstract:
The present invention addresses the problem of improving wear resistance and seizure resistance in a copper-alloy sliding material. Provided is a copper-alloy sliding material containing 0.5-12.0 mass% of Sn, 2.0-8.0 mass% of Bi, and 1.0-5.0 vol% of an inorganic compound, with the remainder comprising Cu and inevitable impurities, wherein the inorganic compound comprises a first inorganic compound having an average particle size of 0.5-3.0 μm and a second inorganic compound having an average particle size of 4.0-20.0 μm, and the value obtained by dividing the volume fraction of the first inorganic compound by the volume fraction of the second inorganic compound is 0.1-1.0.
Inventors:
EBATA YUHEI (JP)
Application Number:
PCT/JP2020/038714
Publication Date:
April 22, 2021
Filing Date:
October 14, 2020
Export Citation:
Assignee:
TAIHO KOGYO CO LTD (JP)
International Classes:
B22F1/00; B22F5/00; C22C1/05; C22C9/00; C22C9/02
Domestic Patent References:
| WO2008018348A1 | 2008-02-14 |
Foreign References:
| JP2010535287A | 2010-11-18 | |||
| JP3421724B2 | 2003-06-30 | |||
| JP2001240925A | 2001-09-04 |
Attorney, Agent or Firm:
KNOWLEDGE PARTNERS PPC (JP)
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