Title:
COPPER OR COPPER ALLOY SPUTTERING TARGET
Document Type and Number:
WIPO Patent Application WO/2015/151901
Kind Code:
A1
Abstract:
This sputtering target for copper or copper alloy wire forming is characterized in that 30% or less of the entire target are regions detected as having measurements where the intensity of a reflection echo from the target bottom surface is 65% or less or 135% or more in ultrasonic flaw detection measurements with the sensitivity being adjusted so that one arbitrary location within the target plane is set as a reference point and the intensity of the reflection echo from the bottom surface of the target when an ultrasonic wave strikes that reference point is 100%. The present invention addresses the problem of providing a copper or copper alloy sputtering target that can improve film uniformity by controlling non-uniformity of composition, density, structure, and the like locally present in the target.
Inventors:
OTSUKI TOMIO (JP)
NAGATA KENICHI (JP)
OKABE TAKEO (JP)
NAGATA KENICHI (JP)
OKABE TAKEO (JP)
Application Number:
PCT/JP2015/058749
Publication Date:
October 08, 2015
Filing Date:
March 23, 2015
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C23C14/34; H01L21/28; H01L21/285; H01L21/3205; H01L21/321; H01L21/768; H01L23/532; C22C9/01; C22C9/05; C22F1/00; C22F1/08
Domestic Patent References:
| WO2003064722A1 | 2003-08-07 | |||
| WO2014136673A1 | 2014-09-12 |
Foreign References:
| JP2012156545A | 2012-08-16 | |||
| JPH10330923A | 1998-12-15 | |||
| JP2009535518A | 2009-10-01 | |||
| JP2013019010A | 2013-01-31 |
Attorney, Agent or Firm:
OGOSHI Isamu et al. (JP)
Isamu Ogoshi (JP)
Isamu Ogoshi (JP)
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