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Title:
COPPER ALLOY
Document Type and Number:
WIPO Patent Application WO/2013/018228
Kind Code:
A1
Abstract:
A copper alloy according to the present invention comprises 1.0-3.6% of Ni, 0.2-1.0% of Si, 0.05-3.0% of Sn, 0.05-3.0% of Zn, and a remainder made up by copper and unavoidable impurities. The copper alloy has an average crystal particle diameter of 25 μm or less, has an aggregated texture having an average area ratio in a cube direction of 20-60% and an average total area ratio in a brass direction, an S direction and a copper direction of 20-50%, having a KAM value of 0.8-3.0, does not undergo cracking even when the copper alloy is subjected to an adhesion bending working at 180˚, and has an excellent balance between strength (particularly an excellent bearing force in a direction transverse to a rolling direction) and bending workability.

Inventors:
SHISHIDO HISAO
ARUGA YASUHIRO
KATSURA SHINYA
MATSUMOTO KATSUSHI
Application Number:
PCT/JP2011/067900
Publication Date:
February 07, 2013
Filing Date:
August 04, 2011
Export Citation:
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Assignee:
KOBE STEEL LTD (JP)
SHISHIDO HISAO
ARUGA YASUHIRO
KATSURA SHINYA
MATSUMOTO KATSUSHI
International Classes:
C22C9/00; C22C9/06; C22C9/02; C22C9/04; C22C9/05; C22C9/10; C22F1/00; C22F1/08; H01B1/02
Domestic Patent References:
WO2009099198A12009-08-13
Foreign References:
JP2011052316A2011-03-17
JP2006152392A2006-06-15
JP2011017072A2011-01-27
JP2008266783A2008-11-06
JP2011162848A2011-08-25
Attorney, Agent or Firm:
OGURI Shohei et al. (JP)
Shohei Oguri (JP)
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Claims:



 
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