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Title:
COPPER-CHROMIUM OXIDE SPINEL, AND RESIN COMPOSITION AND RESIN MOLDED ARTICLE THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/234161
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a copper-chromium oxide spinel that has excellent dispersibility in a resin composition, and excellent adhesion to a plating; and a resin composition and resin molded article containing the copper-chromium oxide spinel. Specifically, provided is a copper-chromium oxide spinel in which, in a volume-equivalent particle-size distribution obtained by a laser diffraction scattering method, the span of the particle-size distribution represented as SPAN=(D90-D10)/D50 is at most 2, where D10, D50, and D90 represent particle sizes corresponding to a cumulative frequency of 10%, 50%, and 90%, respectively, in ascending order of particle size.

Inventors:
TABUCHI MINORU (JP)
SEKINE RYOSUKE (JP)
YAGI NAOTO (JP)
OMICHI KOJI (JP)
YUAN JIANJUN (JP)
Application Number:
PCT/JP2023/019459
Publication Date:
December 07, 2023
Filing Date:
May 25, 2023
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C01G37/00; C08K3/013; C08K3/24; C08L101/00; H05K3/10
Domestic Patent References:
WO2017221372A12017-12-28
WO2018207679A12018-11-15
WO2018003481A12018-01-04
Foreign References:
JP2015501868A2015-01-19
JP2018188342A2018-11-29
JPH08281109A1996-10-29
Attorney, Agent or Firm:
ONO Takayuki (JP)
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