Title:
COPPER-CLAD LAMINATE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2021/039370
Kind Code:
A1
Abstract:
Provided are a copper-clad laminate 10 capable of ensuring high adhesion between a resin film 1 and a copper plating layer 2 while suppressing transmission loss when applied to a flexible circuit board, and a method for producing the same. [Problem] [Solution] The copper-clad laminate is characterized by including a resin film 1 having a relative permittivity of 3.5 or lower and a dielectric loss tangent of 0.008 or lower at a frequency of 10 GHz and an electroless copper plating layer 2 laminated on at least one surface of the resin film 1, the average surface roughness Ra of the resin film 1 being 1-150 nm at the plating layer side interface in contact with the electroless copper plating layer 2, and by the adhesive strength of the resin film 1 and the electroless copper plating layer 2 being 4.2 N/cm or higher.
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Inventors:
MUKAI NOBUAKI (JP)
Application Number:
PCT/JP2020/030460
Publication Date:
March 04, 2021
Filing Date:
August 07, 2020
Export Citation:
Assignee:
TOYO KOHAN CO LTD (JP)
International Classes:
C23C18/20; B32B15/08; C23C18/28; C23C18/48; H05K3/38
Foreign References:
| JP2007254606A | 2007-10-04 | |||
| JP2017208540A | 2017-11-24 | |||
| JP2002256443A | 2002-09-11 | |||
| JP2016113688A | 2016-06-23 |
Attorney, Agent or Firm:
OHTA PATENT AND TRADEMARK ATTORNEYS (JP)
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