Title:
COPPER-CLAD LAMINATE
Document Type and Number:
WIPO Patent Application WO/2019/188087
Kind Code:
A1
Abstract:
Provided is a copper-clad laminate in which it is possible to further enhance transmission characteristics presented by a resin layer while ensuring sufficient peeling strength between a copper foil and the resin layer. A copper-clad laminate that includes: a copper foil; an adhesive layer including a polyphenylene ether resin, a polyimide resin, an olefin-based resin, a liquid-crystal polymer, a polyester resin, a polystyrene resin, a hydrocarbon elastomer, a benzoxazine resin, an active ester resin, a cyanate ester resin, a bismaleimide resin, a butadiene resin, a hydrogenated or non-hydrogenated styrene butadiene resin, an epoxy resin, a fluorinated resin, a resin that has a vinyl group, etc.; and a resin layer, wherein the maximum height Sz on the adhesive-layer-side surface of the copper foil is 6.8 μm or less, and the dielectric tangent value δa of the adhesive layer at a frequency of 1 GHz is equal to or less than the dielectric tangent value δr of the resin layer at a frequency of 1 GHz.
Inventors:
HOSOI TOSHIHIRO (JP)
MATSUSHIMA TOSHIFUMI (JP)
MATSUSHIMA TOSHIFUMI (JP)
Application Number:
PCT/JP2019/009093
Publication Date:
October 03, 2019
Filing Date:
March 07, 2019
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
B32B15/18; B32B7/12; B32B15/08; H05K3/38
Domestic Patent References:
| WO2013105650A1 | 2013-07-18 |
Foreign References:
| JP2017171833A | 2017-09-28 | |||
| JP2017121807A | 2017-07-13 | |||
| JP2016225513A | 2016-12-28 | |||
| CN206840863U | 2018-01-05 | |||
| JP2003309336A | 2003-10-31 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
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