Title:
COPPER CMP SLURRY COMPOSITION
Document Type and Number:
WIPO Patent Application WO2004090937
Kind Code:
A3
Abstract:
A composition that rapidly passivates copper-containing surface to yield a uniform layer of insoluble copper oxide, the composition being useful in chemical-mechanical planarization of copper-containing surfaces is disclosed. The composition is a solution having a pH of equal to or greater than 9 and having an oxidation potential sufficient to oxidize the surface to form non-soluble copper oxides. Also disclosed are methods of making and using the composition.
Inventors:
EIN-ELI YAIR (IL)
STAROSVETSKY DAVID (IL)
ABELEV ESTA (IL)
RABKIN EUGENE (IL)
STAROSVETSKY DAVID (IL)
ABELEV ESTA (IL)
RABKIN EUGENE (IL)
Application Number:
PCT/IL2004/000310
Publication Date:
December 23, 2004
Filing Date:
April 04, 2004
Export Citation:
Assignee:
TECHNION RES & DEV FOUNDATION (IL)
EIN-ELI YAIR (IL)
STAROSVETSKY DAVID (IL)
ABELEV ESTA (IL)
RABKIN EUGENE (IL)
EIN-ELI YAIR (IL)
STAROSVETSKY DAVID (IL)
ABELEV ESTA (IL)
RABKIN EUGENE (IL)
International Classes:
C09G1/02; H01L21/321; (IPC1-7): B24B1/00
Foreign References:
| US6447371B2 | 2002-09-10 | |||
| US5800577A | 1998-09-01 | |||
| US5840629A | 1998-11-24 | |||
| US6313039B1 | 2001-11-06 |
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