Title:
COPPER ELECTROPLATING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2011/036076
Kind Code:
A3
Abstract:
The present invention relates to a copper electroplating composition comprising a copper alkanesulf onate salt, a free alkanesulfonic acid, and one or more organic compounds selected from the group consisting of suppressors, accelerators, levelers, and mixtures thereof, in which the concentration of free acid is from 0 M to about 0.25 M and the composition is free of halide ions. The present invention also relates to a process of metalizing micro-sized trenches or vias in a substrate using the composition.
Inventors:
LAI CHIEN-HSUN
HUANG TZU-TSANG
YANG SHAO-MIN
CHAN CHIAHAO
HUANG TZU-TSANG
YANG SHAO-MIN
CHAN CHIAHAO
Application Number:
PCT/EP2010/063505
Publication Date:
November 24, 2011
Filing Date:
September 15, 2010
Export Citation:
Assignee:
BASF SE (DE)
LAI CHIEN-HSUN
HUANG TZU-TSANG
YANG SHAO-MIN
CHAN CHIAHAO
LAI CHIEN-HSUN
HUANG TZU-TSANG
YANG SHAO-MIN
CHAN CHIAHAO
International Classes:
C25D3/38; C25D5/18
Foreign References:
| US20040045832A1 | 2004-03-11 | |||
| US6605204B1 | 2003-08-12 | |||
| DE4338148A1 | 1995-05-11 | |||
| DE10033934A1 | 2002-01-24 |
Attorney, Agent or Firm:
BASF SE (67056 Ludwigshafen, DE)
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