Title:
COPPER FOIL FOR PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2015/016271
Kind Code:
A1
Abstract:
Provided is a copper foil which is a thin foil of no more than 18μm in thickness that is required for a copper foil for a printed wiring board such as a flexible copper clad laminate (FCCL) or a flexible printed circuit board (FPC), for which foil breakage or wrinkling does not occur when using roll-to-roll conveyance, which is sufficiently softened after heat treatment at a polyimide curing temperature, and which demonstrates high bendability and flexibility. The copper foil for a printed wiring board, the copper foil being copper or an alloy of copper and having a thickness of no more than 18μm, is characterized by the following: a temperature Tmax, at which a gradient (S) of tensile strength represented by formula (1) becomes largest, is 150°C-370°C in a range of no more than 400°C; in such a case, a gradient (Smax) is at least 0.8; and the tensile strength after heat treatment for one hour at Tmax is 80% or less of normal strength. Formula (1): S=(Ts(T-50)-Ts(T))/50 Here, Ts(T) is the tensile strength after heat treatment for one hour at T°C.
Inventors:
EZURA TAKESHI (JP)
SAITO TAKAHIRO (JP)
SHINOZAKI KENSAKU (JP)
FUJISAWA KIMIKO (JP)
SAITO TAKAHIRO (JP)
SHINOZAKI KENSAKU (JP)
FUJISAWA KIMIKO (JP)
Application Number:
PCT/JP2014/070090
Publication Date:
February 05, 2015
Filing Date:
July 30, 2014
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C25D1/04; H01B1/02; H05K1/09
Foreign References:
| JPH07188969A | 1995-07-25 | |||
| JPH10330983A | 1998-12-15 | |||
| JP2004339558A | 2004-12-02 | |||
| JP2012172195A | 2012-09-10 | |||
| JP2012211369A | 2012-11-01 |
Attorney, Agent or Firm:
SATOH, TAKAHISA (JP)
Takahisa Sato (JP)
Takahisa Sato (JP)
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