Title:
COPPER FOIL FOR TRANSPARENT RESIN BASE MATERIAL, AND TRANSPARENT RESIN BASE MATERIAL HAVING FINE COPPER WIRING
Document Type and Number:
WIPO Patent Application WO/2015/178455
Kind Code:
A1
Abstract:
The invention of the present application addresses the problem of providing: a copper foil for a transparent resin base material, which is suitable for use when forming, on a surface of a transparent resin base material, ultrafine copper wiring having a high scratch resistance, high resistance to dissolution in acids and a high anti-reflection effect; a transparent resin base material having fine copper wiring; and a method for producing a transparent resin base material having fine copper wiring. In order to solve this problem, as a copper foil for a transparent resin base material which is for forming copper wiring on a surface of a transparent resin base material, provided is a copper foil for a transparent resin base material which is characterized by providing a surface of a copper foil with a layer having a fine uneven structure, which contains cuprous oxide and cupric oxide and which has a fine uneven structure consisting of these complex copper compounds and formed from needle-like or plate-like protruding portions having a maximum length of 500 nm or less.
Inventors:
TATEOKA AYUMU (JP)
OBATA SHINICHI (JP)
IIDA HIROTO (JP)
WATANABE HIROYUKI (JP)
OBATA SHINICHI (JP)
IIDA HIROTO (JP)
WATANABE HIROYUKI (JP)
Application Number:
PCT/JP2015/064630
Publication Date:
November 26, 2015
Filing Date:
May 21, 2015
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
C23C26/00; B32B15/08; B32B15/20; H01B5/14
Domestic Patent References:
WO2013176133A1 | 2013-11-28 |
Foreign References:
JPS56153797A | 1981-11-27 | |||
JP2008248269A | 2008-10-16 | |||
JP2006021455A | 2006-01-26 | |||
JP2011174132A | 2011-09-08 |
Attorney, Agent or Firm:
YOSHIMURA, KATSUHIRO (JP)
Katsuhiro Yoshimura (JP)
Katsuhiro Yoshimura (JP)
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