Title:
COPPER-NICKEL-SILICON-MANGANESE-TIN-BASED COPPER ALLOY MATERIAL HAVING EXCELLENT STRENGTH, ELECTRICAL CONDUCTIVITY, AND BENDING WORKABILITY, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2023/224218
Kind Code:
A1
Abstract:
The present invention relates to: a copper-nickel-silicon-manganese-tin (Cu-Ni-Si-Mn-Sn)-based copper alloy material having excellent strength, electrical conductivity, and bending workability; and a method for manufacturing same.
Inventors:
PARK CHEOL MIN (KR)
KIM JUN HYUNG (KR)
NAM HYO MOON (KR)
MUN SUN YOUNG (KR)
KIM JUN HYUNG (KR)
NAM HYO MOON (KR)
MUN SUN YOUNG (KR)
Application Number:
PCT/KR2023/002313
Publication Date:
November 23, 2023
Filing Date:
February 17, 2023
Export Citation:
Assignee:
POONGSAN CORP (KR)
International Classes:
C22C9/06; C21D8/12; C21D9/46; C22F1/08
Foreign References:
| KR20010077917A | 2001-08-20 | |||
| KR20140060020A | 2014-05-19 | |||
| KR101875806B1 | 2018-08-02 | |||
| JP2007100136A | 2007-04-19 | |||
| KR100709908B1 | 2007-04-24 | |||
| KR102421870B1 | 2022-07-19 |
Attorney, Agent or Firm:
KBK & ASSOCIATES (KR)
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