COPPER PARTICLE DISPERSION AND METHOD FOR PRODUCING CONDUCTIVE FILM USING SAME

Title:

COPPER PARTICLE DISPERSION AND METHOD FOR PRODUCING CONDUCTIVE FILM USING SAME

Document Type and Number:

WIPO Patent Application WO/2015/068826

Kind Code:

A1

Abstract:

A copper particle dispersion of fine copper particles having an average size of 1-100 nm, the copper particles being coated by an azole compound such as benzotriazole or the like, and coarse copper particles having an average size of 0.3-20 μm dispersed a dispersion medium such as ethylene glycol or the like so that the total amount of fine copper particles and coarse copper particles is 50-90 mass% and the mass ratio is 1:9-5:5 is applied to a substrate by screen printing or flexo printing, prebaked by vacuum drying, then baked by application of light by applying light of a wavelength of 200-800 nm at a pulse period of 100-3000 μs and a pulse voltage of 1600-3600 V.

Inventors:

FUJITA HIDEFUMI (JP)
KANEDA SHUJI (JP)
ITOH DAISUKE (JP)

Application Number:

PCT/JP2014/079657

Publication Date:

May 14, 2015

Filing Date:

October 31, 2014

Export Citation:

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Assignee:

DOWA ELECTRONICS MATERIALS CO (JP)

International Classes:

C09D5/24; B22F1/052; B22F1/0545; B22F1/102; B22F1/16; B22F9/24; C09D7/62; H01B1/00; H01B1/22; H01B13/00; H05K1/09; H05K3/12

Domestic Patent References:

WO2010032841A1	2010-03-25
WO2011090215A1	2011-07-28

Foreign References:

JP2008285761A	2008-11-27
JP2011253868A	2011-12-15
JPH09218508A	1997-08-19
JP2010528428A	2010-08-19
JP2008285761A	2008-11-27

Other References: