Title:
COPPER PARTICLES AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2022/209558
Kind Code:
A1
Abstract:
The present invention provides copper particles wherein the surface of each of core particles comprising metallic copper is covered with an organic protective film formed from organic molecules derived from copper carboxylate, the total density of metal impurities which have the oxidation reduction potential lower than copper and are included in the particles is less than 10 mass ppm, and an average particle diameter of the copper particle in a state in which the copper particles are primary particles is greater than 50 nm but no greater than 200 nm. When the copper particles are analyzed using a time-of-flight secondary ion mass spectrometry (TOF-SIMS) method, the amount of detected CuC2O2H- ions is in a range of at least 0.02 times of the amount of detected Cu+ ions, and the amount of detected C2H3O2
- ion is in a range of at least 0.02 times of the amount of detected Cu+ ions.
Inventors:
YAMAGUCHI TOMOHIKO (JP)
NAKAYA KIYOTAKA (JP)
HIGAMI AKIHIRO (JP)
NAKAYA KIYOTAKA (JP)
HIGAMI AKIHIRO (JP)
Application Number:
PCT/JP2022/009029
Publication Date:
October 06, 2022
Filing Date:
March 03, 2022
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
B22F9/24; B22F1/00; B22F1/102
Foreign References:
| JP2019077926A | 2019-05-23 | |||
| JPH05331508A | 1993-12-14 | |||
| JP2009084614A | 2009-04-23 | |||
| JP2020090725A | 2020-06-11 | |||
| JP2016069716A | 2016-05-09 | |||
| JP2014221927A | 2014-11-27 | |||
| JP2010116625A | 2010-05-27 | |||
| CN102581294A | 2012-07-18 | |||
| JP2021054554A | 2021-04-08 | |||
| JP2017115119A | 2017-06-29 | |||
| JP2638271B2 | 1997-08-06 | |||
| JP3934869B2 | 2007-06-20 | |||
| JP2013072091A | 2013-04-22 | |||
| JP2020059914A | 2020-04-16 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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