Title:
COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND JOINED BODY
Document Type and Number:
WIPO Patent Application WO/2021/066026
Kind Code:
A1
Abstract:
A copper paste for joining, containing: copper particles; a polycarboxylic acid having a melting point of no more than 120°C; and a carrier fluid. A method for manufacturing a joined body, comprising: a first step in which a laminate is prepared that has a first member, the copper paste for joining and a second member, laminated in said order; and a second step in which the laminate is heated and the copper paste for joining is sintered, in a gas atmosphere having a hydrogen concentration of no more than 45%. The joined body comprises the first member, the second member, and the sintered body of the copper paste for joining which joins the first member and the second member.
Inventors:
KAWANA YUKI (JP)
EJIRI YOSHINORI (JP)
NAKAKO HIDEO (JP)
NATORI MICHIKO (JP)
NEGISHI MOTOHIRO (JP)
ISHIKAWA DAI (JP)
SUGAMA CHIE (JP)
EJIRI YOSHINORI (JP)
NAKAKO HIDEO (JP)
NATORI MICHIKO (JP)
NEGISHI MOTOHIRO (JP)
ISHIKAWA DAI (JP)
SUGAMA CHIE (JP)
Application Number:
PCT/JP2020/037198
Publication Date:
April 08, 2021
Filing Date:
September 30, 2020
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
B22F1/00; B22F7/04; B22F9/00; H01B1/00; H01B1/22; H01L21/52; H01L21/60; H01L23/12; H01L23/48; H05K1/09; H05K3/32
Domestic Patent References:
WO2019093121A1 | 2019-05-16 | |||
WO2018168187A1 | 2018-09-20 |
Foreign References:
JP2018170228A | 2018-11-01 | |||
JP2018107421A | 2018-07-05 | |||
JP2019055414A | 2019-04-11 | |||
JP2017119291A | 2017-07-06 | |||
JP2017130623A | 2017-07-27 | |||
JP2013221143A | 2013-10-28 | |||
JP2019057691A | 2019-04-11 | |||
US20160351529A1 | 2016-12-01 |
Other References:
See also references of EP 4023363A4
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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