Title:
COPPER POWDER MANUFACTURING METHOD, COPPER POWDER OBTAINED USING SAID MANUFACTURING METHOD, RESIN COMPOSITION CONTAINING SAID COPPER POWDER, METHOD FOR FORMING CURED PRODUCT OF SAID RESIN COMPOSITION, AND SAID CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2019/131378
Kind Code:
A1
Abstract:
The present invention provides: a method for manufacturing copper powder that can be used as a starting material for a coating, which, when cured, exhibits a low volume resistance value; said copper powder; a resin composition containing said copper powder; a method for forming a cured product; and a cured product. More specifically, the present invention provides: a copper powder manufacturing method comprising a step for subjecting copper particles to a reduction treatment in water using at least one substance selected from the group consisting of potassium borohydride, sodium borohydride, and lithium borohydride, a step for treating the copper particles with at least one substance selected from the group consisting of water, methanol and ethanol, a step for treating the copper particles with at least one substance selected from the group consisting of ether compounds and alcohol compounds, and a step for bringing the copper particles into contact with a compound represented by general formula (1); a copper powder obtained using said manufacturing method; a resin composition containing said copper powder; a method for forming a cured product of said resin composition; and a cured product. (1): (In the formula, X1 represents an alkenyl group or an alkyl group having 14-20 carbon atoms, X2 represents an alkyl group having 1-5 carbon atoms, M represents a titanium atom, a zirconium atom, or a hafnium atom, and a represents an integer of 1-3.)
Inventors:
NUIDA YUSUKE (JP)
HOSOKAWA HITOSHI (JP)
MORITA HIROSHI (JP)
HOSOKAWA HITOSHI (JP)
MORITA HIROSHI (JP)
Application Number:
PCT/JP2018/046782
Publication Date:
July 04, 2019
Filing Date:
December 19, 2018
Export Citation:
Assignee:
ADEKA CORP (JP)
International Classes:
B22F1/00; B22F1/102; B82Y30/00; B82Y40/00; H01B1/00; H01B1/22; H01B5/00; H01B13/00
Foreign References:
| JP2010018880A | 2010-01-28 | |||
| JP2018135564A | 2018-08-30 |
Attorney, Agent or Firm:
SOGA, Michiharu et al. (JP)
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