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Title:
COPPER-RESIN COMPOSITE BODY AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2015/060170
Kind Code:
A1
Abstract:
The present invention relates to a composite body of a resin and copper, and provides a composite body of copper and a resin, which exhibits excellent adhesion between the copper and the resin and is suited to a continuous production process such as an electric wire production process. The present invention uses a copper-resin composite body which is characterized by comprising a metal (3) that is formed of copper or a copper alloy and a resin (7) that is bonded to the metal (3) with a nanoporous layer (5) interposed therebetween, said nanoporous layer (5) being formed on the surface of the metal (3). It is preferable that the nanoporous layer (5) contains copper oxide particles having an average particle diameter of 5-500 nm. A method for producing a copper-resin composite body is characterized by comprising: a step for forming a copper oxide nanoporous layer by means of laser irradiation on the surface of a metal that is formed of copper or a copper alloy; and a step for forming a resin on the copper oxide nanoporous layer.

Inventors:
KIM YONG HOON (JP)
Application Number:
PCT/JP2014/077409
Publication Date:
April 30, 2015
Filing Date:
October 15, 2014
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
H01B7/02; B32B5/18; B32B9/00; B32B15/08; C23C8/12; C23C26/00; C23C28/00; H01B13/00
Foreign References:
JP2011029100A2011-02-10
JP2009212034A2009-09-17
JP2010015907A2010-01-21
JP2013004444A2013-01-07
Other References:
See also references of EP 3062315A4
H. YAMABE ET AL., JPN. SOC. COLOUR MATER., vol. 70, 1997, pages 763
H. YAMABE; W FUNKE, FARBE UND LACK, vol. 96, 1990, pages 497
M. STRATMANN, ADV. MATER., vol. 2, 1996, pages 191
"the Institute of Electrical Engineers", 1999, CORONA PUBLISHING CO., LTD., article "Laser Ablation and its Applications"
Attorney, Agent or Firm:
INOUE, SEIICHI (JP)
Seiichi Inoue (JP)
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