Title:
COPPER TREATMENT ADDITIVE
Document Type and Number:
WIPO Patent Application WO/2023/028088
Kind Code:
A3
Abstract:
A copper treatment additive and methods are provided for applying copper to base metal effectively and efficiently while requiring a reduced frequency of replacing a treatment bath of copper sulfate solution. The copper treatment additive comprises an acidic, liquid mixture for use with a solution of copper sulfate and sulfuric acid to produce a strongly adherent, uniform metallic copper coating on steel. The copper treatment additive includes a first portion of Polyethylene Glycol 3350, a second portion of 4,4'-Methylene Dianiline; and a third portion of 31.45% Hydrochloric Acid. The copper coating has been observed to facilitate wire drawing processes and enhance characteristics associated with welding and decorative wire.
Inventors:
SNIADECKI ROD (US)
Application Number:
PCT/US2022/041276
Publication Date:
April 04, 2024
Filing Date:
August 23, 2022
Export Citation:
Assignee:
ACS ENTPR LLC (US)
International Classes:
C23C18/38; B21C23/22
Foreign References:
| US3664852A | 1972-05-23 | |||
| US20100221574A1 | 2010-09-02 | |||
| CZ56587A3 | 1996-03-13 | |||
| EP0216513A2 | 1987-04-01 | |||
| GB346401A | 1931-04-10 | |||
| CN108315787A | 2018-07-24 | |||
| KR100779691B1 | 2007-11-26 | |||
| US20130313119A1 | 2013-11-28 | |||
| US3730853A | 1973-05-01 | |||
| JP2001152387A | 2001-06-05 |
Attorney, Agent or Firm:
FOSTER, Thomas (US)
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