Title:
CORE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2022/162888
Kind Code:
A1
Abstract:
This core substrate (601), within which an inductor is embedded, is for constituting an interposer (700) onto which a semiconductor element (811) is mounted. The core substrate (601) has a ceramic substrate (100), a first conductor (201), and a first magnetic body (301). The ceramic substrate (100) has a first surface (SF1), and a second surface (SF2) on the opposite side of the first surface (SF1) in the thickness direction, and a first through hole (HL1) between the first surface (SF1) and the second surface (SF2). The first conductor (201) penetrates the first through hole (HL1). The first magnetic body (301) surrounds the first conductor (201) in the first through hole (HL1), and is made of a ceramic material.
Inventors:
WAKAZONO YOSHITSUGU (JP)
TANI MAKOTO (JP)
TANI MAKOTO (JP)
Application Number:
PCT/JP2021/003321
Publication Date:
August 04, 2022
Filing Date:
January 29, 2021
Export Citation:
Assignee:
NGK INSULATORS LTD (JP)
International Classes:
H01L23/12
Domestic Patent References:
| WO2007129526A1 | 2007-11-15 |
Foreign References:
| JP2015135870A | 2015-07-27 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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