Title:
CORROSION-RESISTANT MEMBER FOR A SEMICONDUCTOR MANUFACTURING DEVICE, AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2011/122377
Kind Code:
A1
Abstract:
In the disclosed manufacturing method, first, a powdered Yb2O3 feedstock is uniaxially pressed, with a pressure of 200 kgf/cm², into a disk-shaped molded object with a diameter of 35 mm and a thickness of roughly 10 mm. Said molded object is placed in a graphite firing mold and then hot-press fired at a prescribed firing temperature (1500°C), yielding a corrosion-resistant member for a semiconductor manufacturing device. A pressure of 200 kgf/cm² is used during the hot-press firing, and the molded object is kept in an argon atmosphere until the firing is finished. The hold time at the firing temperature (maximum temperature) is 4 hours. The resulting corrosion-resistant member comprises sintered Yb2O3 with an open porosity of 0.2%.
Inventors:
WATANABE MORIMICHI (JP)
KATSUDA YUJI (JP)
HAYASE TORU (JP)
JINDO ASUMI (JP)
KATSUDA YUJI (JP)
HAYASE TORU (JP)
JINDO ASUMI (JP)
Application Number:
PCT/JP2011/056624
Publication Date:
October 06, 2011
Filing Date:
March 18, 2011
Export Citation:
Assignee:
NGK INSULATORS LTD (JP)
WATANABE MORIMICHI (JP)
KATSUDA YUJI (JP)
HAYASE TORU (JP)
JINDO ASUMI (JP)
WATANABE MORIMICHI (JP)
KATSUDA YUJI (JP)
HAYASE TORU (JP)
JINDO ASUMI (JP)
International Classes:
C04B35/50; H01L21/205; H01L21/3065; H01L21/683
Domestic Patent References:
| WO2007108546A1 | 2007-09-27 | |||
| WO2005009919A1 | 2005-02-03 |
Foreign References:
| JPH1045461A | 1998-02-17 | |||
| JPH1045467A | 1998-02-17 | |||
| JPH1053462A | 1998-02-24 | |||
| JP2006100705A | 2006-04-13 | |||
| JPH104083A | 1998-01-06 | |||
| JP2002362966A | 2002-12-18 |
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
Patent business corporation Itec international patent firm (JP)
Patent business corporation Itec international patent firm (JP)
Download PDF:
Claims: