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Patent Searching and Data


Title:
COVER FILM AND ELECTRONIC COMPONENT PACKAGING EMPLOYING SAME
Document Type and Number:
WIPO Patent Application WO/2016/024529
Kind Code:
A1
Abstract:
 The present invention provides a cover film which exhibits peel strength that continuously remains constant within a range of prescribed values during peeling of the cover film, and which moreover has exceptional transparency, and does not readily give rise to "film rip" during high-speed peeling. This cover film comprises at least (A) a base material layer, (B) an adhesive layer, (C) an intermediate layer, and (D) a heat sealing layer containing a heat-sealable resin. The main component of the (B) adhesive layer is a polyester resin, and 50 mass% or more of the curing agent is isophorone diisocyanate. The (D) heat sealing layer includes (d-1) 50-90 mass% of an olefin resin comprising any one or more olefin-styrene block copolymers that contain 58-82 mass% of an olefin component and ethylene-vinyl acetate copolymers that contain 75-88 mass% of an olefin component, and (d-2) 10-40 mass% of a potassium ionomer having anti-static properties.

Inventors:
SASAKI AKIRA (JP)
IWASAKI TAKAYUKI (JP)
ATSUSAKA TAKANORI (JP)
HIROOKA TADAAKI (JP)
SAKAMOTO SHIGERU (JP)
Application Number:
PCT/JP2015/072403
Publication Date:
February 18, 2016
Filing Date:
August 06, 2015
Export Citation:
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Assignee:
DENKI KAGAKU KOGYO KK (JP)
International Classes:
B32B7/02; B32B27/28; B32B7/12; B32B27/00; B32B27/18; B32B27/32; B65D65/40; B65D73/02
Domestic Patent References:
WO2010104010A12010-09-16
Foreign References:
JP2006327624A2006-12-07
Attorney, Agent or Firm:
SONODA & KOBAYASHI INTELLECTUAL PROPERTY LAW (JP)
Sonoda and the Kobayashi patent business corporation (JP)
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