Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
COVER FILM
Document Type and Number:
WIPO Patent Application WO/2012/049873
Kind Code:
A1
Abstract:
Disclosed is a cover film which is used in combination with a carrier tape and comprises at least a base layer (A), an intermediate layer (B), a releasing layer (C) and a heat seal layer (D) that is capable of being heat sealed to the carrier tape. The intermediate layer (B) contains, as a main component, a linear low density polyethylene that is polymerized using a metallocene catalyst and has a tensile modulus of 200 MPa or less. The releasing layer (C) contains a conductive material and also contains, as a main component, a hydrogenated resin of an aromatic vinyl-conjugated diene copolymer having an aromatic vinyl group content of 15-35% by mass. This cover film is small in variation in peel strength when the cover film is released, and is thus capable of suppressing troubles during the releasing in a mounting process.

Inventors:
SASAKI AKIRA (JP)
TOKUNAGA HISATSUGU (JP)
FUJIMURA TETSUO (JP)
Application Number:
PCT/JP2011/059533
Publication Date:
April 19, 2012
Filing Date:
April 18, 2011
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DENKI KAGAKU KOGYO KK (JP)
SASAKI AKIRA (JP)
TOKUNAGA HISATSUGU (JP)
FUJIMURA TETSUO (JP)
International Classes:
B65D73/02; B65D85/86
Foreign References:
JP2002283512A2002-10-03
JP2003246358A2003-09-02
JPH09267450A1997-10-14
JP2000280411A2000-10-10
JP2007331783A2007-12-27
Other References:
None
Attorney, Agent or Firm:
SONODA Yoshitaka et al. (JP)
Yoshitaka Sonoda (JP)
Download PDF:
Claims: