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Patent Searching and Data


Title:
COVER FILM
Document Type and Number:
WIPO Patent Application WO/2012/137630
Kind Code:
A1
Abstract:
A cover film including, at least, (A) a substrate layer, (B) an intermediate layer, (C) a release layer and (D) a heat seal layer is provided. The release layer (C) comprises a resin composition which comprises (a) a styrene-based resin composition and (b) an ethylene-α-olefin random copolymer, with the content of the copolymer (b) in the release layer being 20 to 50mass%, and which has a Vicat softening temperature of 55 to 80°C, while the heat seal layer (D) comprises an acrylic resin having a glass transition temperature of 55 to 80°C. By the cover film, a carrier tape of polystyrene or the like can be so heat-sealed even in a short time as to achieve sufficient peel strength. Further, the resulting heat-sealed carrier tape exhibits little variation in peel strength, so that when peeling, few components fly out of the carrier tape.

Inventors:
FUJIMURA TETSUO (JP)
TOKUNAGA HISATSUGU (JP)
TANAZAWA YUSUKE (JP)
ONO TAKESHI (JP)
WATANABE TOMOHARU (JP)
SASAKI AKIRA (JP)
IWASAKI TAKAYUKI (JP)
SUGIMOTO KAZUYA (JP)
Application Number:
PCT/JP2012/057942
Publication Date:
October 11, 2012
Filing Date:
March 27, 2012
Export Citation:
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Assignee:
DENKI KAGAKU KOGYO KK (JP)
FUJIMURA TETSUO (JP)
TOKUNAGA HISATSUGU (JP)
TANAZAWA YUSUKE (JP)
ONO TAKESHI (JP)
WATANABE TOMOHARU (JP)
SASAKI AKIRA (JP)
IWASAKI TAKAYUKI (JP)
SUGIMOTO KAZUYA (JP)
International Classes:
B32B25/16; B32B27/30; B65D73/02; B65D85/86
Domestic Patent References:
WO2010018791A12010-02-18
WO2010055804A12010-05-20
Foreign References:
JPH11198299A1999-07-27
JP2007308143A2007-11-29
JP2004042958A2004-02-12
JP2004051106A2004-02-19
JP2006182418A2006-07-13
JPH11278582A1999-10-12
JP2009046132A2009-03-05
Other References:
See also references of EP 2695735A4
Attorney, Agent or Firm:
SONODA Yoshitaka et al. (JP)
Yoshitaka Sonoda (JP)
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Claims: