Title:
COVER FILM
Document Type and Number:
WIPO Patent Application WO/2012/169387
Kind Code:
A1
Abstract:
Disclosed is a cover film and an electronic component package that uses the cover film as a lid material for a thermoplastic resin carrier tape, the cover film having at least a substrate layer (A), an intermediate layer (B), and a heat sealing layer (C) having a thermoplastic resin which can be heat-sealed to a carrier tape, the intermediate layer (B) including a metallocene straight-chain low density polyethylene, the metallocene straight-chain low density polyethylene having a TMA softening temperature of 98 to 109 ˚C according to JIS K7196, and the cover film in some instances having a release layer (D) between the intermediate layer (B) and the heat sealing layer (C).
Inventors:
SASAKI AKIRA (JP)
TOKUNAGA HISATSUGU (JP)
FUJIMURA TETSUO (JP)
TOKUNAGA HISATSUGU (JP)
FUJIMURA TETSUO (JP)
Application Number:
PCT/JP2012/063766
Publication Date:
December 13, 2012
Filing Date:
May 29, 2012
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KK (JP)
SASAKI AKIRA (JP)
TOKUNAGA HISATSUGU (JP)
FUJIMURA TETSUO (JP)
SASAKI AKIRA (JP)
TOKUNAGA HISATSUGU (JP)
FUJIMURA TETSUO (JP)
International Classes:
B65D73/02; B32B27/00; B32B27/32; B65D65/40; B65D85/86
Domestic Patent References:
| WO2010104010A1 | 2010-09-16 | |||
| WO2004094258A1 | 2004-11-04 | |||
| WO2004094258A1 | 2004-11-04 |
Foreign References:
| JPH0839740A | 1996-02-13 | |||
| JP2002283512A | 2002-10-03 | |||
| JPH07223674A | 1995-08-22 | |||
| JPH04279466A | 1992-10-05 | |||
| JP2006327624A | 2006-12-07 |
Other References:
See also references of EP 2719636A4
Attorney, Agent or Firm:
SONODA Yoshitaka et al. (JP)
Yoshitaka Sonoda (JP)
Yoshitaka Sonoda (JP)
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Claims:
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