Title:
COVER LAY FILM, FLEXIBLE WIRING BOARD, AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2013/099172
Kind Code:
A1
Abstract:
[Problem] To provide a cover lay film having excellent adhesion to a base film on a flexible wiring board and having excellent transmission characteristics of electrical signals such as high-frequency waves; and to provide a wiring board. [Solution] An adhesion layer (12) is formed on one surface (e.g. the back surface) of a film substrate (11). The adhesion layer (12) is formed by attaching or formed by coating on the film substrate (11). Here, the film substrate (11) has elasticity greater than that of the adhesion layer (12). The adhesion layer (12) is configured from a synthetic resin containing oligo-phenylene ether and styrene-butadiene elastomers.
Inventors:
NAKAO SATOSHI (JP)
SEKINE NORIAKI (JP)
YAMAGUCHI YUKIO (JP)
SEKINE NORIAKI (JP)
YAMAGUCHI YUKIO (JP)
Application Number:
PCT/JP2012/008166
Publication Date:
July 04, 2013
Filing Date:
December 20, 2012
Export Citation:
Assignee:
YAMAICHI ELECTRONICS CO LTD (JP)
International Classes:
H05K3/28; C09J7/22; C09J7/30; C09J125/10; C09J171/10
Domestic Patent References:
| WO2011111471A1 | 2011-09-15 |
Foreign References:
| JP2011068713A | 2011-04-07 | |||
| JP2010050225A | 2010-03-04 | |||
| JP2010219552A | 2010-09-30 | |||
| JP2011040493A | 2011-02-24 |
Attorney, Agent or Firm:
TANI & ABE, p. c. (JP)
Patent business corporation A valley and Abe patent firm (JP)
Patent business corporation A valley and Abe patent firm (JP)
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Claims: