COVER MATERIAL FOR HERMITIC SEALING AND PACKAGE FOR CONTAINING ELECTRONIC COMPONENT

Title:

COVER MATERIAL FOR HERMITIC SEALING AND PACKAGE FOR CONTAINING ELECTRONIC COMPONENT

Document Type and Number:

WIPO Patent Application WO/2014/073665

Kind Code:

A1

Abstract:

This cover material for hermetic sealing is used for packages for containing electronic components. A cover material for hermetic sealing (1) is configured from a cladding material that comprises a base layer which is configured from an Ni-Cr-Fe alloy containing Ni, Cr and Fe or an Ni-Cr-Co-Fe alloy containing Ni, Cr, Co and Fe and a surface layer which is configured from Ni or an Ni ally and is bonded to one surface of the base layer, said surface being on the electronic component containing member side of the base layer.

Inventors:

YOKOTA MASAYUKI (JP)
YAMAMOTO MASAHARU (JP)

Application Number:

PCT/JP2013/080321

Publication Date:

May 15, 2014

Filing Date:

November 08, 2013

Export Citation:

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Assignee:

NEOMAX MATERIALS CO LTD (JP)
HITACHI METALS LTD (JP)

International Classes:

H01L23/02; H01L23/06; H03H9/02; H03H9/10

Domestic Patent References:

WO2012108083A1

2012-08-16

Foreign References:

JP2002255167A	2002-09-11
JP2000236228A	2000-08-29
JP2009232327A	2009-10-08
JP2012074807A	2012-04-12

Other References: