Title:
COVER PLATE, ELECTRONIC DEVICE COMPRISING COVER PLATE AND METHOD FOR MANUFACTURING COVER PLATE
Document Type and Number:
WIPO Patent Application WO/2022/173197
Kind Code:
A1
Abstract:
Disclosed is a cover plate of an electronic device, the cover plate comprising a first layer comprising a first surface disposed in a first direction, and a second surface disposed in a second direction opposite from the first direction, wherein the first surface of the first layer has formed thereon a first pattern comprising a plurality of first parts, and a second pattern corresponding to the first pattern is formed between the first surface and the second surface of the first layer. Other various embodiments are possible as identified in the present document.
Inventors:
LEE HYEJEONG (KR)
Application Number:
PCT/KR2022/001936
Publication Date:
August 18, 2022
Filing Date:
February 08, 2022
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K5/03; H04M1/02; H05K5/00
Foreign References:
| KR101714309B1 | 2017-03-09 | |||
| KR20200085066A | 2020-07-14 | |||
| US20050037192A1 | 2005-02-17 | |||
| KR20200021085A | 2020-02-27 | |||
| JPH06320699A | 1994-11-22 |
Attorney, Agent or Firm:
KWON, Hyuk-Rok et al. (KR)
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