Title:
COVER FOR SENSOR AND SENSOR MODULE
Document Type and Number:
WIPO Patent Application WO/2023/068187
Kind Code:
A1
Abstract:
This cover for a sensor is provided in an opening of a housing accommodating a sensor. The cover for the sensor is provided with a conductive body, a multi-layer dielectric film, and a heat-generating film in a desired order from the outside of the housing to the inside of the housing. The conductive body and the heat-generating film are insulated from each other. The shortest distance between the conductive body and the heat-generating film is at least 2.0 µm.
Inventors:
TAKEMOTO KAZUYA (JP)
KOYANAGI ATSUSHI (JP)
TATSUOKA NAOTO (JP)
KOYANAGI ATSUSHI (JP)
TATSUOKA NAOTO (JP)
Application Number:
PCT/JP2022/038327
Publication Date:
April 27, 2023
Filing Date:
October 14, 2022
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
G02B5/28; G02B5/26; H05B3/16
Domestic Patent References:
| WO2018052057A1 | 2018-03-22 | |||
| WO2020195247A1 | 2020-10-01 |
Foreign References:
| JPH04110996U | 1992-09-25 | |||
| CN112596289A | 2021-04-02 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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