Title:
COVER TAPE FOR PACKAGING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2012/043608
Kind Code:
A1
Abstract:
The present invention provides a cover tape for packaging electronic components which has suitable transparency and can be inhibited from causing static buildup when separated from the carrier tape. This cover tape for packaging electronic components comprises a base layer and a heat sealant layer formed thereover, wherein the heat sealant layer comprises a polyolefin resin and a polyether/polyolefin copolymer. The weight proportion of the polyether/polyolefin copolymer in the heat sealant layer is 10-70 wt.%.
Inventors:
MASUI KEN (JP)
HIRAMATSU MASAYUKI (JP)
HIRAMATSU MASAYUKI (JP)
Application Number:
PCT/JP2011/072150
Publication Date:
April 05, 2012
Filing Date:
September 28, 2011
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
MASUI KEN (JP)
HIRAMATSU MASAYUKI (JP)
MASUI KEN (JP)
HIRAMATSU MASAYUKI (JP)
International Classes:
B65D73/02; B32B27/00; B65D85/86
Foreign References:
| JP2008285687A | 2008-11-27 | |||
| JP2008214583A | 2008-09-18 | |||
| JP2007002020A | 2007-01-11 | |||
| JP2000142786A | 2000-05-23 | |||
| JP2001301819A | 2001-10-31 | |||
| JP2006312489A | 2006-11-16 |
Other References:
See also references of EP 2623433A4
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
Sumio Tanai (JP)
Sumio Tanai (JP)
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Claims:
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