Title:
COVER TAPE
Document Type and Number:
WIPO Patent Application WO/2011/158550
Kind Code:
A1
Abstract:
Disclosed is a cover tape which comprises at least a base layer (A), an intermediate layer (B), a peeling layer (C), the primary component of which is a thermoplastic resin, and a heat seal layer (D), the primary component of which is a thermoplastic resin that can be heat sealed to a carrier tape. The tensile storage modulus (c) of the thermoplastic resin that constitutes the peeling layer (C) is within the range of 1×106 Pa to 1×108 Pa. The tensile storage modulus (d) of the thermoplastic resin that constitutes the heat seal layer (D) is within the range of 1×108 Pa to 1×1010 Pa. The ratio of (c) and (d) satisfies 1×104≥(d)/(c)≥1×10. This kind of cover tape has the appropriate peel strength and sufficiently low fluctuation in peel strength when heat sealed to a thermoplastic resin carrier tape. Therefore, the tape will not tear even under shock caused by high-speed peeling, and adherence of electronic parts does not occur even when set aside for a long period of time of 24 to 72 hours in a high-temperature environment of 60 to 80ºC.
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Inventors:
SASAKI AKIRA (JP)
TOKUNAGA HISATSUGU (JP)
FUJIMURA TETSUO (JP)
TOKUNAGA HISATSUGU (JP)
FUJIMURA TETSUO (JP)
Application Number:
PCT/JP2011/059545
Publication Date:
December 22, 2011
Filing Date:
April 18, 2011
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KK (JP)
SASAKI AKIRA (JP)
TOKUNAGA HISATSUGU (JP)
FUJIMURA TETSUO (JP)
SASAKI AKIRA (JP)
TOKUNAGA HISATSUGU (JP)
FUJIMURA TETSUO (JP)
International Classes:
B65D73/02; B32B27/18; B32B27/32; B65D65/02; B65D85/38
Foreign References:
| JP2002154573A | 2002-05-28 | |||
| JP2005263257A | 2005-09-29 |
Attorney, Agent or Firm:
SONODA Yoshitaka et al. (JP)
Yoshitaka Sonoda (JP)
Yoshitaka Sonoda (JP)
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Claims: