Title:
CRACK EVALUATION DEVICE, CRACK EVALUATION METHOD, AND CRACK EVALUATION PROGRAM
Document Type and Number:
WIPO Patent Application WO/2021/014754
Kind Code:
A1
Abstract:
Provided are a crack evaluation device, a crack evaluation method, and a crack evaluation program that enable reduction of a load in creation of crack vectors and acquisition of an evaluation result equivalent to the evaluation result by a worker. This crack evaluation device is provided with: a crack information acquisition unit that processes an image taken of a structure and that acquires crack information about cracks in the structure; a crack vector generation unit that generates crack vectors on the basis of the acquired crack information and that generates a connecting crack vector for connecting spatially separated crack vectors among the generated crack vectors on the basis of connection criteria; a display unit that displays the generated crack vectors and the connecting crack vector in a classified manner; an operation unit that receives a user's operation for editing the displayed crack vectors and the displayed connecting crack vector; and an evaluation unit that acquires an evaluation result of cracks in the structure on the basis of crack information about the edited crack vectors and the edited connecting crack vector.
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Inventors:
MATSUMOTO KAZUMA (JP)
Application Number:
PCT/JP2020/021193
Publication Date:
January 28, 2021
Filing Date:
May 28, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G06T11/80
Domestic Patent References:
| WO2017126367A1 | 2017-07-27 |
Foreign References:
| JP2005227829A | 2005-08-25 | |||
| JPH06148089A | 1994-05-27 | |||
| JPH06148089A | 1994-05-27 | |||
| JP2002257744A | 2002-09-11 | |||
| JP4006007B2 | 2007-11-14 |
Other References:
See also references of EP 4006842A4
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
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