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Patent Searching and Data


Title:
CRIMP CONNECTION TERMINAL AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2017/150644
Kind Code:
A1
Abstract:
The objective of the invention is to obtain a compact crimp connection terminal ensuring that the conductor crimping portion thereof may retain therein the conductor portion of an electric wire by being swaged thereon. This crimp connection terminal is formed by punching-out and bending a conductive metal plate (1). The crimp connection terminal is provided with a male-type connection portion (2) in the front, a conductor crimping portion (3) in the center, and a cover crimping portion (4) in the back. In the conductor crimping portion (3), side portions (3a, 3b) are folded into a lower layer plate (3c) and an upper layer plate (3d), the end portions of the side portions (3a, 3b) butting one another, resulting in a seam (3g). In addition, the bottom portion (3h) of the upper layer plate (3d) have, for instance, three punched long holes (3i to 3k), each having an elongated groove shape in a slanted direction relative to the crimp connection terminal length direction. On the surface of the punched long hole (3i), a shallow circular recessed portion (3l) is formed through stamping, thereby forming two steps comprising: an edge (3m) from the recessed portion (3l); and a new edge (3n') resulting from an edge (3n) of the punched long hole (3i), obtained by the punching, being pushed out to the interior of the punched long hole (3i) by the stamping.

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Inventors:
AMBO TSUGIO (JP)
Application Number:
PCT/JP2017/008198
Publication Date:
September 08, 2017
Filing Date:
March 01, 2017
Export Citation:
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Assignee:
SANKO ELECTRIC CO LTD (JP)
International Classes:
H01R4/18; H01R43/16
Foreign References:
JPS5167321U1976-05-27
JP2009129627A2009-06-11
JPS5676269U1981-06-22
JPS5727668U1982-02-13
JP2003338329A2003-11-28
JPH04108864U1992-09-21
JP2009123597A2009-06-04
JP2009123597A2009-06-04
Other References:
See also references of EP 3425735A4
Attorney, Agent or Firm:
HIBIYA Yukihiko et al. (JP)
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