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Patent Searching and Data


Title:
CRIMP STRUCTURE OF WIRE AND SHIELDED CONDUCTION PATH
Document Type and Number:
WIPO Patent Application WO/2019/026561
Kind Code:
A1
Abstract:
The purpose of the present invention is to improve the strength of fixation between a wire and a crimped part. A crimped part (25) constituting a connection structure for a shielded wire (11) is provided with: a substrate part (30) disposed along the outer circumference of the shielded wire (11); a first crimp part (31) extended in a cantilever shape from one side edge of the substrate part (30) in the circumferential direction of the shielded wire (11), and crimped so as to enclose the outer circumference of the shielded wire (11); a second crimp part (36) extended in a cantilever shape from the other side edge of the substrate part (30) in the circumferential direction in the opposite direction to that of the first crimp part (31), and crimped so as to enclose the outer circumference of the shielded wire (11); and a restricting part (46) disposed along the outer circumference of the shielded wire (11), the restricting part (46) causing a first engaging part (34) of the first crimp part (31) and a second engaging part (39) of the second crimp part (36) to engage with each other in the circumferential direction in opposite directions with respect to each other.

Inventors:
HAMADA KAZUAKI (JP)
MURATA ATSUSHI (JP)
Application Number:
PCT/JP2018/025944
Publication Date:
February 07, 2019
Filing Date:
July 10, 2018
Export Citation:
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Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01R13/6581; H01R4/18
Foreign References:
JP5459351B22014-04-02
JP2010176960A2010-08-12
JP2004319175A2004-11-11
JP2000012162A2000-01-14
JP2000260495A2000-09-22
JP2006310139A2006-11-09
Attorney, Agent or Firm:
GRANDOM PATENT LAW FIRM (JP)
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