Title:
CROSS-LINKED POLYIMIDE RESIN AND METHOD FOR PRODUCING SAME, ADHESIVE RESIN COMPOSITION AND CURED PRODUCT THEREOF, COVER LAY FILM, CIRCUIT BOARD, HEAT-CONDUCTIVE SUBSTRATE, AND HEAT-CONDUCTIVE POLYIMIDE FILM
Document Type and Number:
WIPO Patent Application WO/2012/172972
Kind Code:
A1
Abstract:
Disclosed is a cross-linked polyimide resin produced by reacting (A) a polyimide siloxane having a ketone group with (B) an amino compound having at least two primary amino groups as functional groups. Each of the amino groups in the amino compound, i.e., the component (B), is reacted with at least a part of the ketone group in the polyimide siloxane, i.e., the component (A), to form a C=N bond. Thus, the cross-linked polyimide resin has such a structure that the polyimide siloxane is crosslinked through the amino compound. When a hydrogen-bond-forming group is contained in the component (A), the formation of the C=N bond can be promoted.
Inventors:
MORI AKIRA (JP)
SUTO YOSHIKI (JP)
WANG HONGYUAN (JP)
SUTO YOSHIKI (JP)
WANG HONGYUAN (JP)
Application Number:
PCT/JP2012/063859
Publication Date:
December 20, 2012
Filing Date:
May 30, 2012
Export Citation:
Assignee:
NIPPON STEEL & SUMIKIN CHEM CO (JP)
MORI AKIRA (JP)
SUTO YOSHIKI (JP)
WANG HONGYUAN (JP)
MORI AKIRA (JP)
SUTO YOSHIKI (JP)
WANG HONGYUAN (JP)
International Classes:
C08G73/10; B32B27/00; B32B27/34; C09J7/20; C09J11/04; C09J179/08; H05K3/28
Domestic Patent References:
| WO2011077917A1 | 2011-06-30 | |||
| WO2011040194A1 | 2011-04-07 |
Foreign References:
| JP2010204146A | 2010-09-16 | |||
| JPH06345866A | 1994-12-20 | |||
| JPH0913001A | 1997-01-14 | |||
| JP2008291063A | 2008-12-04 | |||
| US3816303A | 1974-06-11 | |||
| US4020050A | 1977-04-26 |
Attorney, Agent or Firm:
WATANABE Kazuhiro et al. (JP)
Kazuhiro Watanabe (JP)
Kazuhiro Watanabe (JP)
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Claims: