Title:
CROSS PCB MODULE MOUNTING-TYPE PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2019/017558
Kind Code:
A1
Abstract:
The present invention relates to a technology for mounting a cross PCB module on one surface of a base substrate so as to implement a printed circuit board to replace conventional double-sided printed circuit boards, as an alternative of general double-sided printed circuit boards in which a circuit pattern is formed on both sides of the base substrate. The present invention allows one pattern bundle unit, crossing the other pattern bundle unit on one surface of a base substrate unit, to be cut in the crossing area thereof, and then allows a pre-patterned cross PCB module to be mounted as much as the cut area, thereby enabling the cut pattern bundle unit to mutually conduct electricity. The cross PCB module implements a highly integrated circuit pattern compared to that of a jumper element, and enables a single-sided circuit pattern to replace an existing double-sided printed circuit board. According to the present invention, integration of conventional double-sided printed circuit boards is implemented with a single-sided printed circuit board, thereby significantly reducing unit cost and decreasing discharge of pollutants.
Inventors:
MIN GYEONG HWAN (KR)
Application Number:
PCT/KR2018/003013
Publication Date:
January 24, 2019
Filing Date:
March 15, 2018
Export Citation:
Assignee:
MIN GYEONG HWAN (KR)
International Classes:
H05K1/02; H05K1/11
Foreign References:
| KR960033103U | 1996-10-24 | |||
| KR101402617B1 | 2014-06-03 | |||
| KR20090118277A | 2009-11-18 | |||
| JP2008166471A | 2008-07-17 | |||
| JP2001042763A | 2001-02-16 |
Attorney, Agent or Firm:
KIM, Do Hyoung (KR)
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