Title:
CROSS SECTION IMAGING WITH IMPROVED 3D VOLUME IMAGE RECONSTRUCTION ACCURACY
Document Type and Number:
WIPO Patent Application WO/2020/244795
Kind Code:
A8
Abstract:
The present invention relates to a three-dimensional circuit pattern inspection technique by cross sectioning of integrated circuits and, more particularly, to a method, computer program product and apparatus for obtaining a 3D volume image of an integrated semiconductor sample. The method employs a feature based alignment of cross section images based on features of an integrated semiconductor sample.
Inventors:
KORB THOMAS (DE)
NEUMANN JENS TIMO (DE)
FOCA EUGEN (DE)
BUXBAUM ALEX (US)
AVISHAI AMIR (US)
LEE KEUMSIL (US)
SCHULMEYER INGO (DE)
KLOCHKOV DMITRY (DE)
NEUMANN JENS TIMO (DE)
FOCA EUGEN (DE)
BUXBAUM ALEX (US)
AVISHAI AMIR (US)
LEE KEUMSIL (US)
SCHULMEYER INGO (DE)
KLOCHKOV DMITRY (DE)
Application Number:
PCT/EP2020/000101
Publication Date:
February 25, 2021
Filing Date:
May 25, 2020
Export Citation:
Assignee:
ZEISS CARL SMT GMBH (DE)
CARL ZEISS SMT INC (US)
CARL ZEISS SMT INC (US)
International Classes:
G06T7/33; G01N23/2251; G06T7/00; H01J37/28
Attorney, Agent or Firm:
TESCH-BIEDERMANN, Carmen (DE)
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