CU-NI-SI ALLOY AND METHOD FOR MANUFACTURING SAME

WIPO Patent Application WO/2013/031279

A1

Provided is a Cu-Ni-Si alloy and a method for manufacturing the Cu-Ni-Si alloy, the Cu-Ni-Si alloy being provided with exceptional strength and bendability, and being suitable as an electro-conductive spring material for a connector, terminal, relay, switch or other component. The Cu-Ni-Si alloy contains 1.0 to 4.5 wt% of Ni, 0.2 to 1.0 wt% of Si, and copper and inevitable impurities constituting the balance. Electron back-scatter diffraction (EBSD) measuring is performed. When the crystal orientation is analyzed the area of cube orientation {001} <100> constitutes 5% or more, the area of brass orientation {110} <112> constitutes 20% or less, and the area of copper orientation {112} <111> constitutes 20% or less. The work-hardening coefficient is 0.2 or less.

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NAGANO MASAYUKI (JP)

PCT/JP2012/059207

March 07, 2013

April 04, 2012

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JX NIPPON MINING & METALS CORP (JP)
NAGANO MASAYUKI (JP)

C22C9/06; C22C9/00; C22C9/01; C22C9/02; C22C9/04; C22C9/05; C22C9/10; C22F1/08; H01B1/02; C22F1/00

WO2011068135A1

2011-06-09

JP2011117034A	2011-06-16
JP2011017072A	2011-01-27
JP2002266042A	2002-09-18

AXIS Patent International (JP)
Axis international patent business corporation (JP)

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