Title:
CURABLE ADHESIVE SHEET FOR REINFORCEMENT OF FLEXIBLE PRINTED WIRING BOARD, FLEXIBLE PRINTED WIRING BOARD HAVING REINFORCEMENT SECTION, PRODUCTION METHOD THEREFOR, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/069895
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing: a curable adhesive sheet that can provide reinforcement to a level capable of preventing detachment or the like of mounted components, without using a reinforcing plate which may cause an increase in the thickness of an electronic device, etc., and that is also less likely to cause warpage of a flexible printed wiring board, whereby production efficiency can be dramatically improved; and a production method for a flexible printed wiring board having a reinforcement section formed of a thermally cured product of the curable adhesive sheet. The present invention pertains to a curable adhesive sheet which is used for reinforcement of a flexible printed wiring board, and has a release liner on at least one surface thereof, the release liner having a melting point of 260°C or more; and a production method for a flexible printed wiring board having a reinforcement section formed of a thermally cured product of the curable adhesive sheet.
Inventors:
TANII SHOTA (JP)
SHIMOOKA SUMIO (JP)
MORINO AKINORI (JP)
SHIMOOKA SUMIO (JP)
MORINO AKINORI (JP)
Application Number:
PCT/JP2018/036819
Publication Date:
April 11, 2019
Filing Date:
October 02, 2018
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C09J7/00; B32B27/00; C09J163/00; C09J201/00; H05K1/02; B05C1/08
Domestic Patent References:
| WO2017104479A1 | 2017-06-22 | |||
| WO2010038644A1 | 2010-04-08 | |||
| WO2007122708A1 | 2007-11-01 |
Foreign References:
| JP2017183376A | 2017-10-05 | |||
| JP2017112360A | 2017-06-22 | |||
| JP2014112708A | 2014-06-19 | |||
| JP2016203475A | 2016-12-08 | |||
| JP2007116130A | 2007-05-10 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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