Title:
CURABLE COMPOSITION, CURED PRODUCT, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2022/114133
Kind Code:
A1
Abstract:
[Problem] To provide a curable composition having suitable flexibility, suitably low warpage after light exposure, as well as suitable heat resistance for a thin film substrate such as a flexible wiring board. [Solution] A curable composition containing: (A) a radical polymerizable monomer represented by formula 1 (R1 in formula (1) represents a C1-4 hydrocarbon group which may be linear, branched, or cyclic and may include an ether bond (the hydrocarbon group may have a substituent)); (B) a photocurable urethane compound having two (meth)acryloyl groups; (C) a compound other than (A) and (B) having a (meth)acryloyl group; (D) a photopolymerization initiator; and (E) a thermosetting component. The curable composition has low viscosity, and after being coated on a thin film substrate and exposed to light, is capable of keeping warpage of the thin film substrate low. Furthermore, the cured coated film has excellent heat resistance and has both flexibility and low warpage.
Inventors:
ODAGIRI YUTO (JP)
ITO HIDEYUKI (JP)
YONEDA KAZUYOSHI (JP)
ITO HIDEYUKI (JP)
YONEDA KAZUYOSHI (JP)
Application Number:
PCT/JP2021/043408
Publication Date:
June 02, 2022
Filing Date:
November 26, 2021
Export Citation:
Assignee:
TAIYO INK MFG CO LTD (JP)
International Classes:
C08F290/06
Domestic Patent References:
| WO2020085166A1 | 2020-04-30 |
Foreign References:
| JP2013014718A | 2013-01-24 | |||
| JP2014040585A | 2014-03-06 |
Attorney, Agent or Firm:
ETOH Toshiaki (JP)
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