Title:
CURABLE COMPOSITION, CURED PRODUCT, AND METHOD FOR USING CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2021/193452
Kind Code:
A1
Abstract:
The present invention pertains to: a curable composition containing the component (A) and component (B) below; a cured product obtained by curing the curable composition; and a method for using the curable composition as an adhesive agent for optical element-fixing materials or as a sealing material for optical element-fixing materials. The present invention provides a curable composition that exhibits an excellent curability and storage stability; a cured product provided by the cure of the curable composition; and a method for using the curable composition as an adhesive for optical element-fixing materials or as a sealing material for optical element-fixing materials. The component (A) is a polysilsesquioxane compound having one species or two or more species of repeat units given by formula (a-1) [R1 is a group selected from the group consisting of unsubstituted alkyl groups having 1 to 10 carbons, alkyl groups having 1 to 10 carbons and having a substituent, unsubstituted aryl groups having 6 to 12 carbons, and aryl groups having 6 to 12 carbons and having a substituent.], and component (B) is a thermal acid generator.
Inventors:
MIURA SUSUMU (JP)
MIYAWAKI MANABU (JP)
MIYAWAKI MANABU (JP)
Application Number:
PCT/JP2021/011453
Publication Date:
September 30, 2021
Filing Date:
March 19, 2021
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C08G77/04; C08K5/54; C08L83/04; H01L23/29; H01L23/31
Foreign References:
| JP2011006610A | 2011-01-13 | |||
| JP2005089601A | 2005-04-07 | |||
| JP2014208615A | 2014-11-06 | |||
| JP2009079219A | 2009-04-16 | |||
| JP2007226204A | 2007-09-06 |
Attorney, Agent or Firm:
OHISHI Haruhito (JP)
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