Title:
CURABLE COMPOSITION AND CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2016/047519
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a curable composition which enables strong adhesion, without carrying out a primer treatment, to a metal, glass or coated surface, and especially to a porous base material such as mortar or stone, and in addition, the composition can minimize deterioration in adhesive properties when immersed in water and exhibits good storage stability. This curable composition is characterized by containing (A) a reactive silicon group-containing organic polymer (excluding component (B)) and (B) an organic polymer which has an aromatic ring structure and/or a hydrogenated aromatic ring structure, has a reactive silicon group at a terminal and has no hydroxyl group. Component (B) is preferably an alkylene oxide addition reaction product of a bisphenol compound.
More Like This:
| WO/2018/215463 | LOW MODULUS SILYLATED MASTIC COMPOSITION |
| JP2004346128 | CURABLE RESIN COMPOSITION |
| WO/2013/042638 | THERMALLY CONDUCTIVE, MOISTURE-CURABLE RESIN COMPOSITION |
Inventors:
TACHIKAKE NODOKA (JP)
ITANO YU (JP)
ITANO YU (JP)
Application Number:
PCT/JP2015/076271
Publication Date:
March 31, 2016
Filing Date:
September 16, 2015
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
C08L101/10; C08L71/02; C09J171/02; C09J183/04; C09J201/10; C09K3/10
Foreign References:
| JP2006052321A | 2006-02-23 | |||
| JP2006169348A | 2006-06-29 |
Attorney, Agent or Firm:
YASUTOMI & Associates (JP)
Patent business corporation Yasutomi international patent firm (JP)
Patent business corporation Yasutomi international patent firm (JP)
Download PDF: