Title:
CURABLE COMPOSITION, CURED PRODUCT THEREOF, PREPREG, CIRCUIT BOARD, BUILD-UP FILM, SEMICONDUCTOR SEALING MATERIAL AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/089998
Kind Code:
A1
Abstract:
Provided are a curable composition which has high compatibility even when containing a hydrocarbon resin (hydrocarbon plasticizer) having extremely low polarity and a cured product of which has a low dielectric loss tangent, a cured product thereof, a prepreg, a circuit board, a build-up film, a semiconductor sealing material and a semiconductor device. Use is made of a curable composition containing an active ester resin, a hydrocarbon resin and a curing agent, wherein the active ester resin is a reaction product of a phenolic hydroxyl group-containing resin (A), which is a reaction product of a compound (a1) having an alkyl group with 5 or more carbon atoms and a phenolic hydroxyl group and a divinyl compound (a2), and an aromatic dicarboxylic acid or an acid halide thereof (B).
Inventors:
KIM YOUNGCHAN (JP)
HAYASHI KOJI (JP)
HAYASHI KOJI (JP)
Application Number:
PCT/JP2022/038147
Publication Date:
May 25, 2023
Filing Date:
October 13, 2022
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08G59/40; C08G63/52; C08L67/06; C08L101/02
Foreign References:
| JP2018009129A | 2018-01-18 | |||
| JPH0770293A | 1995-03-14 | |||
| JP2010077344A | 2010-04-08 | |||
| JP2009242560A | 2009-10-22 | |||
| JP2015174986A | 2015-10-05 |
Attorney, Agent or Firm:
ONO Takayuki (JP)
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