Title:
CURABLE COMPOSITION, CURABLE FILM, AND DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/157561
Kind Code:
A1
Abstract:
Provided is a curable composition which contains semiconductor particles (A), a polymerizable compound (B), a polymerization initiator (C) and an oxidation inhibitor (D), wherein the formula 11.5≤MB/MC≤150 is satisfied when the content (mass%) of the polymerizable compound (B) relative to the total mass of the curable composition is MB, and the content (mass%) of the polymerization initiator (C) relative thereto is MC.
Inventors:
TOKUDA MASAYOSHI (JP)
IWAWAKI HIROSHI (JP)
TSUCHIYA MITSUO (JP)
HAYASAKA KOMADA MEGUMI (JP)
NISHIKAWA YOSHINAGA YUKAKO (JP)
IWAWAKI HIROSHI (JP)
TSUCHIYA MITSUO (JP)
HAYASAKA KOMADA MEGUMI (JP)
NISHIKAWA YOSHINAGA YUKAKO (JP)
Application Number:
PCT/JP2023/001667
Publication Date:
August 24, 2023
Filing Date:
January 20, 2023
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
C08F2/44; C08F292/00
Domestic Patent References:
| WO2021215254A1 | 2021-10-28 | |||
| WO2021048244A1 | 2021-03-18 | |||
| WO2022244669A1 | 2022-11-24 | |||
| WO2022244668A1 | 2022-11-24 |
Foreign References:
| JP2021096323A | 2021-06-24 | |||
| JP2021161394A | 2021-10-11 | |||
| JP2021161392A | 2021-10-11 | |||
| KR20210117047A | 2021-09-28 | |||
| JP2021105164A | 2021-07-26 | |||
| JP2021128342A | 2021-09-02 | |||
| JP2020015894A | 2020-01-30 | |||
| KR102153629B1 | 2020-09-08 | |||
| US20170191638A1 | 2017-07-06 | |||
| JP2008197613A | 2008-08-28 |
Attorney, Agent or Firm:
NAKAYAMA, Tohru et al. (JP)
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