Title:
CURABLE COMPOSITION, MATERIAL FOR PROTECTING SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/216388
Kind Code:
A1
Abstract:
The present invention is a curable composition including an epoxy compound (A), a curing agent (B) which is liquid at 23°C, an inorganic filler (C) which has a thermal conductivity of 10 W/m∙K or greater and is spherical, and an ion exchanger (X), the ion exchanger (X) comprising a zirconium-based cation exchanger and a bismuth-based anion exchanger. Through the present invention, it is possible to provide a curable composition having excellent heat dissipation properties, insulating reliability, and application properties.
Inventors:
NISHIMURA TAKASHI (JP)
NAKAMURA SHIGERU (JP)
KOBAYASHI YUUSUKE (JP)
NAKAMURA SHIGERU (JP)
KOBAYASHI YUUSUKE (JP)
Application Number:
PCT/JP2019/018624
Publication Date:
November 14, 2019
Filing Date:
May 09, 2019
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08L63/00; C08G59/04; C08K3/013; C08K3/22; C08K3/34; H01L23/29; H01L23/31
Domestic Patent References:
| WO2017158994A1 | 2017-09-21 | |||
| WO2013191075A1 | 2013-12-27 |
Foreign References:
| JP2017214546A | 2017-12-07 | |||
| JP2017041633A | 2017-02-23 | |||
| JP2018056595A | 2018-04-05 | |||
| JP2009091510A | 2009-04-30 | |||
| JP2002179883A | 2002-06-26 | |||
| JPH05140419A | 1993-06-08 | |||
| JPH09314758A | 1997-12-09 | |||
| JPH09188866A | 1997-07-22 |
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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