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Patent Searching and Data


Title:
CURABLE COMPOSITION AND METHOD FOR ADHERING SUBSTRATES THEREOF
Document Type and Number:
WIPO Patent Application WO/2021/092879
Kind Code:
A1
Abstract:
Described is a curable composition, and particularly a two-component composition comprising a silane modified polymer; an epoxy resin terminated with epoxy terminal group; wherein the composition further comprises a hardening agent and a compatibilizer which has at least one silane group and at least one epoxy terminal group. The curable composition exhibits enhanced adhesion strength and good elongation at break. A method for applying the curable composition on the surface of a substrate is also provided.

Inventors:
TANG ZHENGMING (CN)
CHEN YONGCHUN (CN)
XU XIUQING (CN)
CHEN HONGYU (CN)
ZHAI XUEMEI (CN)
SHI KE (CN)
WANG NAN (CN)
MENG QINGWEI (CN)
Application Number:
PCT/CN2019/118720
Publication Date:
May 20, 2021
Filing Date:
November 15, 2019
Export Citation:
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Assignee:
DOW GLOBAL TECHNOLOGIES LLC (US)
TANG ZHENGMING (CN)
CHEN YONGCHUN (CN)
XU XIUQING (CN)
CHEN HONGYU (CN)
ZHAI XUEMEI (CN)
SHI KE (CN)
WANG NAN (CN)
MENG QINGWEI (CN)
International Classes:
C08L83/12; C08L63/00; C09J163/00; C09J171/00
Domestic Patent References:
WO2014062284A12014-04-24
WO2002008335A22002-01-31
Foreign References:
EP1167451A12002-01-02
US4657986A1987-04-14
US20020016411A12002-02-07
CN106519913A2017-03-22
US20180305596A12018-10-25
CN109294489A2019-02-01
Other References:
See also references of EP 4058515A4
Attorney, Agent or Firm:
SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC (CN)
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