CURABLE COMPOSITION, METHOD FOR FORMING INVERTED PATTERN, METHOD FOR FORMING FILM, AND METHOD FOR PRODUCING ARTICLE

Title:

CURABLE COMPOSITION, METHOD FOR FORMING INVERTED PATTERN, METHOD FOR FORMING FILM, AND METHOD FOR PRODUCING ARTICLE

Document Type and Number:

WIPO Patent Application WO/2023/243484

Kind Code:

A1

Abstract:

A new technology relating to a curable composition is provided. The curable composition comprises a polymerizable compound, a photopolymerization initiator, and a solvent. The polymerizable compound includes a polymerizable silicon compound, the curable composition has a viscosity at 23°C of 2-60 mPa·s, and the curable composition from which the solvent has been removed has a viscosity at 23°C of 30-10,000 mPa·s. The content of the solvent is 5-95 vol% with respect to the whole curable composition.

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Inventors:

OOTSUKA MASANOBU (JP)
ITO TOSHIKI (JP)

Application Number:

PCT/JP2023/020957

Publication Date:

December 21, 2023

Filing Date:

June 06, 2023

Export Citation:

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Assignee:

CANON KK (JP)

International Classes:

B29C59/02; H01L21/027

Domestic Patent References:

WO2022054772A1	2022-03-17
WO2022075361A1	2022-04-14
WO2021153600A1	2021-08-05
WO2020246405A1	2020-12-10

Foreign References:

JP2012099638A

2012-05-24

Attorney, Agent or Firm:

OHTSUKA PATENT OFFICE, P.C. (JP)

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