Title:
CURABLE COMPOSITION, METHOD OF PRODUCING CURABLE COMPOSITION, CURED MATERIAL, METHOD OF USING CURABLE COMPOSITION, AND OPTICAL DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/031729
Kind Code:
A1
Abstract:
The present invention is: a curable composition containing components (A) through (C), the curable composition characterized by containing component (A) and component (B) in a mass ratio of [component (A):component (B)] = 100:0.3-100:50; a method of producing the curable composition; a cured material obtained by curing the curable composition; a method of using the curable composition as an adhesive for an optical element fixing material or a sealing material for an optical element fixing material; and an optical device. Component (A): a curable polysilsesquioxane compound having repeating units represented by formula (a-1) R1SiO3/2 (In the formula, R1 is a C1-10 alkyl group having a substituent or not having a substituent, or an aryl group having a substituent or not having a substituent.). Component (B): microparticles having an average primary particle diameter of 5-40 nm. Component (C): a silane coupling agent having an acid anhydride structure in the molecule thereof. The present invention provides: a curable composition and a method of producing the same, the curable composition having excellent workability in an application step and giving a cured material having excellent adhesion, peeling resistance, and heat resistance; a cured material obtained by curing the curable composition; a method of using the curable composition as an adhesive for an optical element fixing material or a sealing material for an optical element fixing material; and an optical device.
More Like This:
Inventors:
NAKAYAMA HIDEKAZU (JP)
MATSUI MASAMI (JP)
KASHIO MIKIHIRO (JP)
MATSUI MASAMI (JP)
KASHIO MIKIHIRO (JP)
Application Number:
PCT/JP2015/073607
Publication Date:
March 03, 2016
Filing Date:
August 21, 2015
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C08L83/04; C08K3/00; C08K5/5435; C09J11/04; C09J11/06; C09J183/04; C09K3/10; H01L23/29; H01L23/31; H01L33/56
Domestic Patent References:
| WO2014069508A1 | 2014-05-08 | |||
| WO2013141360A1 | 2013-09-26 | |||
| WO2011111667A1 | 2011-09-15 | |||
| WO2009101753A1 | 2009-08-20 | |||
| WO2009104505A1 | 2009-08-27 |
Foreign References:
| JP2002313621A | 2002-10-25 | |||
| JP2009138059A | 2009-06-25 | |||
| JP2011173738A | 2011-09-08 | |||
| JP2007507583A | 2007-03-29 |
Other References:
See also references of EP 3187546A4
Attorney, Agent or Firm:
OHISHI HARUHITO (JP)
Haruhito Oishi (JP)
Haruhito Oishi (JP)
Download PDF: