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Patent Searching and Data


Title:
CURABLE COMPOSITION, CURABLE PASTE MATERIAL, CURABLE SHEET MATERIAL, CURABLE MODELING MATERIAL, CURING METHOD, AND CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2019/043778
Kind Code:
A1
Abstract:
This curable composition includes a cationic polymerizable compound, a thermal polymerization initiator, and a storage stabilizer. The cationic polymerizable compound includes at least two selected from the group consisting of glycidyl ether compounds, alicyclic epoxy compounds, and oxetane compounds. The thermal polymerization initiator content is 0.3-3 parts by mass per 100 parts by mass of the cationic polymerizable compound, and chain curing is possible through the thermal energy generated by the polymerization reaction of the cationic polymerizable compound.

Inventors:
HAYASHI NORIYA (JP)
SAKAKIBARA TOSHIKATSU (JP)
KOBAYASHI YUSUKE (JP)
KIMURA TATSUYA (JP)
Application Number:
PCT/JP2017/030905
Publication Date:
March 07, 2019
Filing Date:
August 29, 2017
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Assignee:
MITSUBISHI HEAVY IND LTD (JP)
International Classes:
C08G59/68; C08G65/18
Domestic Patent References:
WO2015129670A12015-09-03
WO2015046333A12015-04-02
WO2016158523A12016-10-06
Foreign References:
JP2017008145A2017-01-12
JP2016210849A2016-12-15
JP2016069433A2016-05-09
JP2013186976A2013-09-19
JP2012219262A2012-11-12
Other References:
See also references of EP 3647337A4
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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