Title:
CURABLE COMPOSITION, THERMALLY CONDUCTIVE MATERIAL, AND DEVICE WITH THERMALLY CONDUCTIVE LAYER
Document Type and Number:
WIPO Patent Application WO/2018/147425
Kind Code:
A1
Abstract:
A first problem addressed by the present invention is to provide a curable composition by which a cured product can be obtained that has excellent organic matter dispersibility and high thermal conductivity. Further, a second problem addressed by the present invention is to provide a thermally conductive material formed by curing the curable composition, and a device with thermally conductive layer provided with the thermally conductive material. This curable composition contains: an inorganic substance which is selected from the group consisting of inorganic nitrides and inorganic oxides; a compound which has a monovalent substituent selected from a boronic acid group, a boronic acid ester group, an aldehyde group, and a pyridinium group and which has a molecular weight greater than or equal to 1000; and a polymerizable monomer.
Inventors:
HITOMI SEIICHI (JP)
TAKAHASHI KEITA (JP)
TAKAHASHI KEITA (JP)
Application Number:
PCT/JP2018/004660
Publication Date:
August 16, 2018
Filing Date:
February 09, 2018
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F2/44; C08F292/00; C08K3/00; C08L33/04; H01L23/373
Domestic Patent References:
WO2016084873A1 | 2016-06-02 | |||
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Other References:
ANGEW. CHEM. INT. ED., vol. 51, 2012, pages 7990 - 7993
"Liquid Crystal Handbook", 2000, MARUZEN CO., LTD., pages: 330 - 333
"Highly Thermally Conductive Composite Material", CMC PUBLISHING CO., LTD.
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"Highly Thermally Conductive Composite Material", CMC PUBLISHING CO., LTD.
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
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